Microfill™ LVF IV Acid Copper from Dupont Dow Rhom Hass company
2025-12-16 10:01
- Microfill™ LVF IV Acid Copper
Advanced Flip-Chip packages demand higher functionality in increasingly fine pitch substrates, resulting in the need to reliably create fine metal features. DuPont™ Microfill™ LVF IV Acid Copper plating process has been designed to meet these needs, using insoluble anodes and direct current (DC) plating in electroplating systems designed for substrate manufacturing.
- Designed for pattern plate capability, with excellent laser micro-via fill and pattern plate uniformity of Flip-Chip substrates.
- DC process with insoluble anodes to minimize idle-time effects.
- Bright, highly leveled, ductile deposit
- Easily analyzed and controlled by conventional CVS techniques.
Next Generation Copper Pattern Plating for IC Package Application
Excellent viafill performance across the working panel in isolated and dense areas.
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