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NEWPOL 50HB-400在電(diàn)鍍中的(de)應用
NEWPOL 50HB-400是(shì)一種用(yong)于PCB、五金(jīn)及塑膠(jiao)酸銅電(diàn)鍍的深(shen)度走位(wei)劑添🌍加(jiā)用表面(mian)活性劑(jì),尤其在(zai)低電位(wei)有優異(yì)的表現(xiàn)。該産品(pǐn)是原裝(zhuāng)日本進(jin)口, 包裝(zhuāng)爲 18 KG/CAN 或者(zhě) 210 KG/DRUM。NEWPOL 50HB-400産品是(shì)一種低(dī)分子量(liàng)複合聚(ju)醚,主鹽(yan)含量 100%,PH 4-6,外(wai)觀: 無色(se)透明有(you)一定黏(nián)度的液(ye)體,泡沫(mo)非常低(di),幾乎沒(mei)有泡沫(mo)。濁點45-50℃。
發(fā)布時間(jiān):
2025-12-13
MS-930三(san)維聚矽(xī)氧烷消(xiao)泡劑
MS-930是(shì)三維聚(ju)矽氧烷(wan)化合物(wu)類水性(xìng)消泡劑(ji),它能在(zài)水💘中輕(qīng)松乳化(hua),因而在(zài)水性工(gong)業液體(ti)中有最(zuì)佳的分(fen)散性。MS-930在(zài)典型的(de)工業清(qīng)洗🍉/沖洗(xi)實踐中(zhong)都表現(xian)出很好(hao)的易清(qīng)洗性,且(qiě)不易造(zào)成清洗(xi)之後的(de)工藝瑕(xia)疵問題(tí)。
發布時(shi)間:
Microfill™ LVF IV Acid Copper from Dupont Dow Rhom Hass company
Advanced Flip-Chip packages demand higher functionality in increasingly fine pitch substrates, resulting in the need to reliably create fine metal features. DuPont™ Microfill™ LVF IV Acid Copper plating process has been designed to meet these needs, using insoluble anodes and direct current (DC) plating in electroplating systems designed for substrate manufacturing.
Michelman麥可門(mén)ProHere® E 00002乙烯-丙(bing)烯酸EAA封(fēng)閉樹脂(zhī)
ProHere® grades are waterborne polymer dispersions and emulsions specifically developed for use in metal coatings. The range encompasses both polymer resins that can serve as organic binders in a coating formulation as well as lubricants and anti-scratch additives for metal processing and in-use lubricants.
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Michelman麥可門(mén)Prohere E 00019 乙烯-丙(bing)烯酸EAA封(fēng)閉樹脂(zhī)
BRAND FAMILY OVERVIEW ProHere® grades are waterborne polymer dispersions and emulsions specifically developed for use in metal coatings. The range encompasses both polymer resins that can serve as organic binders in a coating formulation as well as lubricants and anti-scratch additives for metal processing and in-use lubricants.
Michelman麥可門(mén) Prohere 201082CX 乙烯-丙(bing)烯酸EAA封(feng)閉樹脂(zhī)
Developed for anti-corrosion primers and pre-treatment sealers for metallic, substrates providing excellent adhesion to various metallic substrates like steel, electroplated steel and aluminum. In addition, it provides excellent water resistance, and chemical resistance to acids and many solvents.
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